Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
The "MDS-100/MDS-300" is a plasma dicing device that utilizes inductively coupled technology, enabling stable and uniform continuous processing of 25 wafers with high-output plasma.
It allows processing while maintaining high uniformity without causing damage to the wafers, similar to that caused by saws or lasers.
Using the Bosch process with a high-speed gas switching system, it achieves excellent sidewall shape and processing of free shapes, providing superior dicing strength compared to existing methods.
【Features】
■ Contributes to improved die quality, yield, and freedom of die shape with excellent processing capability
■ Supports multiple wafer sizes (MDS-100: φ4" to 8", MDS-300: φ8" to 12")
■ Dicing using Bosch process with inductively coupled plasma
■ Achieves fast and stable step switching through a high-speed gas switching system
■ Allows setting of parameter morphing and its fluctuation trends
*For more details, please refer to the PDF document or feel free to contact us.
![[Data] Plasma dicing of various materials](https://image.mono.ipros.com/public/product/image/47c/2000499782/IPROS50645552467826755000.png?w=280&h=280)
